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Rapidus explores panel-level packaging on glass for next-gen processors
(
tomshardware.com
)
3 points
by
rbanffy
6 days ago
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1 comment
soruly
3 days ago
[–]
It seems the square "wafer" (silicon substrate) is developed by Mitsubishi Materials a year ago.
https://www.mmc.co.jp/corporate/en/news/2024/news20240821.ht...
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Search:
https://www.mmc.co.jp/corporate/en/news/2024/news20240821.ht...
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